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? 2004 microchip technology inc. ds21420d-page 1 tc4421/tc4422 features ? high peak output current: 9a wide input supply voltage operating range: - 4.5v to 18v high continuous output current: 2a max fast rise and fall times: - 30 ns with 4,700 pf load - 180 ns with 47,000 pf load short propagation delays: 30 ns (typ) low supply current: - with logic ? 1 ? input ? 200 a (typ) - with logic ? 0 ? input ? 55 a (typ) low output impedance: 1.4 ? (typ) latch-up protected: will withstand 1.5a output reverse current input will withstand negative inputs up to 5v pin-compatible with the tc4420/tc4429 6a mosfet driver space-saving 8-pin 6x5 dfn package applications line drivers for extra heavily-loaded lines pulse generators driving the largest mosfets and igbts local power on/off switch motor and solenoid driver general description the tc4421/tc4422 are high-current buffer/drivers capable of driving large mosfets and igbts. these devices are essentially immune to any form of upset, except direct overvoltage or over-dissipation. they cannot be latched under any conditions within their power and voltage ratings. these parts are not subject to damage or improper operation when up to 5v of ground bounce is present on their ground termi- nals. they can accept, without damage or logic upset, more than 1a inductive current of either polarity being forced back into their outputs. in addition, all terminals are fully protected against up to 4 kv of electrostatic discharge. the tc4421/tc4422 inputs may be driven directly from either ttl or cmos (3v to 18v). in addition, 300 mv of hysteresis is built into the input, providing noise immunity and allowing the device to be driven from slowly rising or falling waveforms. with both surface-mount and pin-through-hole packages and four operating temperature range offer- ings, the tc4421/22 family of 9a mosfet drivers fit into most any application where high gate/line capacitance drive is required. package types (1) 8-pin pdip/ 1 2 3 4 v dd 5 6 7 8 output gnd v dd input nc gnd output tc4421 tc4422 5-pin to-220 v dd gnd input gnd output tc4421 tc4422 tab is common to v dd note 1: duplicate pins must both be connected for proper operation. 2: exposed pad of the dfn package is electrically isolated. tc4421 tc4422 v dd output gnd output soic 8-pin dfn (2) v dd input nc gnd 2 3 4 5 6 7 8 1 tc4421 tc4422 v dd output gnd output tc4421 tc4422 v dd output gnd output 9a high-speed mosfet drivers
tc4421/tc4422 ds21420d-page 2 ? 2004 microchip technology inc. functional block diagram effective input output input gnd v dd 300 mv 4.7v tc4421 c = 25 pf tc4422 inverting non-inverting 200 a
? 2004 microchip technology inc. ds21420d-page 3 tc4421/tc4422 1.0 electrical characteristics absolute maximum ratings? supply voltage ..................................................... +20v input voltage .................... (v dd + 0.3v) to (gnd ? 5v) input current (v in > v dd )................................... 50 ma package power dissipation (t a 70c) 5-pin to-220 .................................................... 1.6w dfn .............................................................. note 2 pdip ............................................................ 730 mw soic............................................................ 750 mw package power dissipation (t a 25c) 5-pin to-220 (with heatsink) ........................ 12.5w thermal impedances (to case) 5-pin to-220 r j-c ...................................... 10c/w ? stresses above those listed under ?absolute maximum ratings? may cause permanent da mage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the spec ifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, t a = +25c with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 1.8 ? v logic ? 0 ?, low input voltage v il ?1.30.8v input current i in ?10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance, high r oh ?1.4? ? i out = 10 ma, v dd = 18v output resistance, low r ol ?0.91.7 ? i out = 10 ma, v dd = 18v peak output current i pk ?9.0?av dd = 18v continuous output current i dc 2??a10v v dd 18v, t a = +25c ( tc4421/tc4422 cat only) (note 3) latch-up protection withstand reverse current i rev ? >1.5 ? a duty cycle 2%, t 300 sec switching time (note 1) rise time t r ?6075ns figure 4-1 , c l = 10,000 pf fall time t f ?6075ns figure 4-1 , c l = 10,000 pf delay time t d1 ?3060ns figure 4-1 delay time t d2 ?3360ns figure 4-1 power supply power supply current i s ? ? 0.2 55 1.5 150 ma a v in = 3v v in = 0v operating input voltage v dd 4.5 ? 18 v note 1: switching times ensured by design. 2: package power dissipation is dependent on the copper pad area on the pcb. 3: tested during characterization, not production tested.
tc4421/tc4422 ds21420d-page 4 ? 2004 microchip technology inc. dc characteristics (over ope rating temperature range) temperature characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in ?10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance, high r oh ?2.43.6 ? i out = 10 ma, v dd = 18v output resistance, low r ol ?1.82.7 ? i out = 10 ma, v dd = 18v switching time (note 1) rise time t r ? 60 120 ns figure 4-1 , c l = 10,000 pf fall time t f ? 60 120 ns figure 4-1 , c l = 10,000 pf delay time t d1 ?5080ns figure 4-1 delay time t d2 ?6580ns figure 4-1 power supply power supply current i s ? ? ? ? 3 0.2 ma v in = 3v v in = 0v operating input voltage v dd 4.5 ? 18 v note 1: switching times ensured by design. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0?+70c specified temperature range (e) t a ?40 ? +85 c specified temperature range (v) t a ?40 ? +125 c maximum junction temperature t j ? ? +150 c storage temperature range t a ?65 ? +150 c package thermal resistances thermal resistance, 5l-to-220 ja ?71?c/w thermal resistance, 8l-6x5 dfn ja ? 33.2 ? c/w typical 4-layer board with vias to ground plane thermal resistance, 8l-pdip ja ?125?c/w thermal resistance, 8l-soic ja ?120?c/w
? 2004 microchip technology inc. ds21420d-page 5 tc4421/tc4422 2.0 typical performance curves note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 220 200 180 160 140 120 100 80 60 40 20 0 4681012 14 16 18 1000 pf 4700 pf 10,000 pf 22,000 pf t rise (nsec) v dd (v) t rise (nsec) 5v 15v 300 250 200 150 100 50 0 100 1000 10,000 100,000 10v c load (pf) 90 60 40 30 70 50 80 -40 0 40 80 120 time (nsec) t a ( c) c load = 10,000 pf v dd = 15v t fall t rise 180 160 140 120 100 80 60 40 20 0 4 6 8 1012141618 1000 pf 4700 pf 10,000 pf 22,000 pf t fall (nsec) v dd (v) t fall (nsec) 300 250 200 150 100 50 0 100 1000 10,000 5v 10v 15v 100,000 c load (pf) 50 81012141618 4 time (nsec) 45 40 35 30 25 6 v dd (v) c load = 1000 pf t d1 t d2
tc4421/tc4422 ds21420d-page 6 ? 2004 microchip technology inc. note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-7: supply current vs. capacitive load (v dd = 18v). figure 2-8: supply current vs. capacitive load (v dd = 12v). figure 2-9: supply current vs. capactive load (v dd = 6v). figure 2-10: supply current vs. frequency (v dd = 18v). figure 2-11: supply current vs. frequency (v dd = 12v). figure 2-12: supply current vs. frequency (v dd = 6v). 220 100 200 180 160 140 120 100 80 60 40 20 0 100,000 10,000 1000 1.125 mhz 632 khz 200 khz 20 khz 2 mhz 63.2 kh z i supply (ma) c load (pf) v dd = 18v i supply (ma) 180 160 140 120 100 60 0 80 40 20 1.125 mhz 63.2 khz 20 khz 632 khz 200 khz 2 mhz 100 100,000 10,000 1000 v dd = 12v c load (pf) i supply (ma) 100 90 80 70 60 50 40 30 20 10 0 20 khz 632 khz 200 khz 2 mhz 63.2 khz 100 100,000 10,000 1000 v dd = 6v c load (pf) fre q uenc y ( khz ) 180 100 80 60 40 20 0 120 140 160 22,000 pf 470 pf 10,000 pf 0.1 f 4700 pf 10 100 1000 47,000 pf i supply (ma) v dd = 18v i supply (ma) frequency (khz) 180 100 80 60 40 20 0 120 140 160 470 pf 22,000 pf 4700 pf 10,000 pf 47,000 pf 10 100 1000 v dd = 12v 0.1 f i supply (ma) 47,000 pf 120 40 20 0 100 4700 pf 10 fre q uenc y ( khz ) 100 1000 60 80 22,000 pf 470 pf 10,000 pf 10 100 1000 v dd = 6v 0.1 f
? 2004 microchip technology inc. ds21420d-page 7 tc4421/tc4422 note: unless otherwise indicated, t a = +25c with 4.5v v dd 18v. figure 2-13: propagation delay vs. input amplitude. figure 2-14: crossover energy vs. supply voltage. figure 2-15: high-state output resistance vs. supply voltage. figure 2-16: propagation delay vs. temperature. figure 2-17: quiescent supply current vs. temperature. figure 2-18: low-state output resistance vs. supply voltage. 120 time (nsec) 110 100 90 80 70 60 50 40 30 20 10 0 12345678910 input amplitude (v) v dd = 10v c load = 10,000 pf t d1 t d2 10 -7 10 -6 asec note: the values on this graph represent the loss seen by the driver during a complete cycle. for the loss in a single transition, divide the stated value by 2. 4681012141618 v dd (v) 10 -8 6 46 81012141618 5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 v dd (v) t j = 150 c t j = 25 c r ds(on) ( ? ) 50 ?40 ?20 0 20 40 60 80 100 120 ?60 time (nsec) 45 40 35 30 25 20 t a ( c) t d1 t d2 v dd = 18v c load = 10,000 pf v in = 5v 10 2 -40 -20 0 20 40 60 80 100 120 -60 v dd = 18v input = 1 input = 0 i quiescent ( a) t j ( c) 10 3 r ds(on) ( ? ) 46 81012141618 6 5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 v dd (v) t j = 150 c t j = 25 c
tc4421/tc4422 ds21420d-page 8 ? 2004 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 18v with respect to the ground pin. the v dd input should be bypassed to ground with a local ceramic capacitor. the value of the capacitor should be chosen based on the capacitive load that is being driven. a minimum value of 1.0 f is suggested. 3.2 control input the mosfet driver input is a high-impedance, ttl/cmos compatible input. the input also has 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 cmos push-pull output the mosfet driver output is a low-impedance, cmos, push-pull style output capable of driving a capacitive load with 9.0a peak currents. the mosfet driver output is capable of withstanding 1.5a peak reverse currents of either polarity. 3.4 ground the ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 exposed metal pad the exposed metal pad of the 6x5 dfn package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package. pin no. 8-pin pdip, soic pin no. 8-pin dfn pin no. 5-pin to-220 symbol description 11?v dd supply input, 4.5v to 18v 2 2 1 input control input, ttl/cmos compatible input 3 3 ? nc no connection 4 4 2 gnd ground 5 5 4 gnd ground 6 6 5 output cmos push-pull output 7 7 ? output cmos push-pull output 883v dd supply input, 4.5v to 18v ?pad? ncexposed metal pad ??tabv dd metal tab is at the v dd potential
? 2004 microchip technology inc. ds21420d-page 9 tc4421/tc4422 4.0 applications information figure 4-1: switching time test circuits. inverting driver non-inverting driver input t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall 10 nsec output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% +18v 0v 90% 10% 10% 10% 90% +5v +18v 0v 0v 0v 90% 26 7 5 4 18 c l = 10,000 pf 0.1 f 4.7 f input v dd = 18v output 0.1 f tc4421 tc4422 note: pinout shown is for the dfn, pdip and soic packages.
tc4421/tc4422 ds21420d-page 10 ? 2004 microchip technology inc. 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc4421 cpa256 0420 legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard otp marking consists of microchip part number, year code, week code, and traceability code. 5-lead to-220 xxxxxxxxx xxxxxxxxx yywwnnn example: tc4421 cat xxxxxxxxx 0420256 8-lead dfn example : xxxxxxx xxxxxxx xxyyww nnn tc4421 emf 0420 256 8-lead soic (208 mil) example: xxxxxxxx xxxxxxxx yywwnnn gtc4421 esm 0420256
? 2004 microchip technology inc. ds21420d-page 11 tc4421/tc4422 5-lead plastic transistor outline (at) (to-220) l h1 q e b e1 e c1 j1 f a d a (5x) ?p ejector pin e3 drawing no. c04-036 notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" (0.254mm) per side. jedec equivalent: to-220 *controlling parameter mold draft angle lead width lead thickness a c1 b .014 dimension limits overall height lead length overall width lead pitch a l e .540 min e units .060 inches* .022 0.36 0.56 millimeters .190 .560 13.72 min max 4.83 14.22 max .160 4.06 3 7 3 7 overall length d 1.02 0.64 .040 .025 overall lead centers e1 .263 .385 .560 .273 6.68 6.93 .072 1.52 1.83 .415 9.78 10.54 .590 14.22 14.99 through hole diameter p .146 .156 3.71 3.96 j1 base to bottom of lead .090 2.29 .115 2.92 through hole center q .103 2.87 .113 2.62 flag thickness f .045 1.40 .055 1.14 flag length h1 .234 6.55 .258 5.94 space between leads e3 .030 1.02 .040 0.76
tc4421/tc4422 ds21420d-page 12 ? 2004 microchip technology inc. 8-lead plastic dual flat no lead package (mf) 6x5 mm body (dfn-s) ? saw singulated
? 2004 microchip technology inc. ds21420d-page 13 tc4421/tc4422 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 mold draft angle bottom 5 10 15 5 10 15 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
tc4421/tc4422 ds21420d-page 14 ? 2004 microchip technology inc. 8-lead plastic small outline (sm) ? medium, 208 mil body (soij) (jeita/eiaj standard, formerly called soic) foot angle 048 048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.43 0.36 .020 .017 .014 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.64 0.51 .030 .025 .020 l foot length 5.33 5.21 5.13 .210 .205 .202 d overall length 5.38 5.28 5.11 .212 .208 .201 e1 molded package width 8.26 7.95 7.62 .325 .313 .300 e overall width 0.25 0.13 0.05 .010 .005 .002 a1 standoff 1.98 .078 a2 molded package thickness 2.03 .080 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units a2 a a1 l c 2 1 d n p b e e1 .070 .075 .069 .074 1.78 1.75 1.97 1.88 exceed .010" (0.254mm) per side. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not notes: drawing no. c04-056 *controlling parameter
? 2004 microchip technology inc. ds21420d-page 15 tc4421/tc4422 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tc4421: 9a high-speed mosfet driver, inverting tc4422: 9a high-speed mosfet driver, non-inverting temperature range: c = 0c to +70c (pdip and to-220 only) e = -40c to +85c v = -40c to +125c package: at = to-220, 5-lead (c-temp only) mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) pa = plastic dip (300 mil body), 8-lead sm = plastic soic (208 mil body), 8-lead sm713 = plastic soic (208 mil body), 8-lead (tape and reel) pb free g = lead-free device = blank * available on selected packa ges. contact your local sales representative for availability part no. x xx package temperature range device examples: a) tc4421cat: 9a high-speed inverting mosfet driver, to-220 package, 0c to +70c. b) TC4421ESMG: 9a high-speed inverting mosfet driver, pb free soic package, -40c to +85c. c) tc4421vmf: 9a high-speed inverting mosfet driver, dfn package, -40c to +125c. a) tc4422vpa: 9a high-speed non-inverting mosfet driver, pdip package, -40c to +125c. b) tc4422epa: 9a high-speed non-inverting mosfet driver, pdip package, -40c to +85c. c) tc4422emf: 9a high-speed inverting mosfet driver, dfn package, -40c to +85c. xxx tape & reel x pb free data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc4421/tc4422 ds21420d-page 16 ? 2004 microchip technology inc. notes:
? 2004 microchip technology inc. ds21420d-page 17 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. no representation or warranty is given and no liability is assumed by microchip technol ogy incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of micr ochip?s products as critical components in life support syst ems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or ot herwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, migratable memory, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance ar e trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2004, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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